Description

Operates with the receiving current set to 4.5mA ~ 7.9mA. Features transmitting current rated at 5.2mA ~ 12.7mA. Provides a maximum data rate potential of 2Mbps. Runs at a frequency of 2.405GHz ~ 2.48GHz. Provides 49 GPIO pins for flexible input/output interfacing. Total memory size 256kB Flash, 128kB SRAM for device storage capability. Communication modulation technique GFSK for data transmission. Mounting configuration Surface Mount for structural stability. Overall I/O 49 for digital links. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 68-VFQFN Exposed Pad that offers mechanical and thermal protection. Type of package 68-VFQFPN (8x8) that preserves the integrity of the device. The necessary output power 6dBm for peak device efficiency. Product status Active concerning availability and lifecycle. Protocol for communication Bluetooth v5.3, Thread, Zigbee® for control or interaction. Type or family of RF protocol 802.15.4, Bluetooth for communication standards. Rating for the sensitivity of sensor or input response -100dBm. Ports designated for serial communication interfaces ADC, I2C, SPI, UART, USART, USB. Classification series for the product or component STM32WB55xx. Supplier package type 68-VFQFPN (8x8) for component selection. Voltage requirement 1.71V ~ 3.6V for electrical specifications. Type classification TxRx + MCU for specifications. Voltage supply 1.71V ~ 3.6V for device operation.