Description

Operates with the receiving current set to 3.4mA. Features transmitting current rated at 4.3mA. Provides a maximum data rate potential of 2Mbps. Provides 20 GPIO pins for flexible input/output interfacing. Total memory size 192kB Flash, 24kB SRAM for device storage capability. Communication modulation technique GFSK for data transmission. Mounting configuration Surface Mount for structural stability. Overall I/O 20 for digital links. Temperature range -40°C ~ 105°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR) for safeguarding or transporting components. Style of the enclosure/case 36-XFBGA, WLCSP that offers mechanical and thermal protection. Type of package 36-WLCSP (2.65x 2.59) that preserves the integrity of the device. The necessary output power 8dBm for peak device efficiency. Product status Active concerning availability and lifecycle. Protocol for communication Bluetooth v5.4 for control or interaction. Type or family of RF protocol Bluetooth for communication standards. Rating for the sensitivity of sensor or input response -104dBm. Ports designated for serial communication interfaces ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART. Classification series for the product or component STM32WB. Supplier package type 36-WLCSP (2.65x 2.59) for component selection. Voltage requirement 1.7V ~ 3.6V for electrical specifications. Type classification TxRx + MCU for specifications. Voltage supply 1.7V ~ 3.6V for device operation.