Description

Provides a maximum data rate potential of 2Mbps. Runs at a frequency of 2.4GHz ~ 5GHz. Provides 39 GPIO pins for flexible input/output interfacing. Total memory size 3.6MB ROM, 1.7MB SRAM for device storage capability. Communication modulation technique OFDM for data transmission. Mounting configuration Surface Mount for structural stability. Overall I/O 39 for digital links. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 143-BGA, WLBGA that offers mechanical and thermal protection. Type of package SG-XFWLB-143 that preserves the integrity of the device. The necessary output power 19dBm for peak device efficiency. Product status Active concerning availability and lifecycle. Protocol for communication Bluetooth v5.4 for control or interaction. Type or family of RF protocol 802.15.4 for communication standards. Rating for the sensitivity of sensor or input response -105.5dBm. Ports designated for serial communication interfaces I2C, SDIO, SPI, UART. Classification series for the product or component AIROC™ Bluetooth. Supplier package type SG-XFWLB-143 for component selection. Voltage requirement 3V ~ 4.8V for electrical specifications. Type classification TxRx + MCU for specifications. Voltage supply 3V ~ 4.8V for device operation.