Description

Provides a maximum data rate potential of 3Mbps. Runs at a frequency of 2.4GHz ~ 5GHz. Provides 40 GPIO pins for flexible input/output interfacing. Total memory size 1.125MB ROM, 388kB SRAM for device storage capability. Mounting configuration Surface Mount for structural stability. Overall I/O 40 for digital links. Temperature range -20°C ~ 70°C for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 106-UFBGA, WLBGA that offers mechanical and thermal protection. Type of package SG-XFWLB-106 that preserves the integrity of the device. The necessary output power 20dBm for peak device efficiency. Product status Active concerning availability and lifecycle. Protocol for communication Bluetooth v5.4 for control or interaction. Type or family of RF protocol Bluetooth, WiFi for communication standards. Ports designated for serial communication interfaces I2C, SDIO, SPI, UART. Classification series for the product or component AIROC™ Bluetooth. Supplier package type SG-XFWLB-106 for component selection. Voltage requirement 3.2V ~ 4.6V for electrical specifications. Type classification TxRx + MCU for specifications. Voltage supply 3.2V ~ 4.6V for device operation.