Description

Configured for circuit type described as SP3T. Offers a 2.4GHz ~ 2.5GHz frequency spectrum for broad-spectrum applications. Supports 46dBm IIP3 to maintain linearity and RF performance. Configured with 50Ohm impedance to maintain signal quality. Offers 0.75dB insertion loss to minimize signal attenuation. Offers 35dB isolation to prevent electrical interference. Mounting configuration Surface Mount for structural stability. Temperature range -40°C ~ 90°C for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 8-XFQFN Exposed Pad that offers mechanical and thermal protection. Type of package 8-MLP (1.1x1.1) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. The category of RF Bluetooth, WLAN for frequency and modulation specifications. Supplier package type 8-MLP (1.1x1.1) for component selection. Voltage requirement 3V ~ 5V for electrical specifications. Frequency rate 2.5GHz for assessing performance. Voltage supply 3V ~ 5V for device operation.