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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | HSP50016 | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Primary Function Mode | - | |
| Oscillation Rate Hz | - | |
| Wireless RF Category | AMPS, CDMA, Cellular, GSM, NA, TDMA | |
| Additional Feature Specs | Down Converter | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 44-LCC (J-Lead) | |
| Vendor Package Type | 44-PLCC (16.58x16.58) |
Description
Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Mounting configuration Surface Mount for structural stability. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 44-LCC (J-Lead) that offers mechanical and thermal protection. Type of package 44-PLCC (16.58x16.58) that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. The category of RF AMPS, CDMA, Cellular, GSM, NA, TDMA for frequency and modulation specifications. Extra characteristics Down Converter for product specifications. Classification series for the product or component HSP50016. Supplier package type 44-PLCC (16.58x16.58) for component selection. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications.
