Attribute
Description
Manufacturer Part Number
GX62476B-HIU
Manufacturer
Description
MODULE REQUIRES WAFER
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Primary Function Mode | Driver | |
| Oscillation Rate Hz | - | |
| Wireless RF Category | General Purpose | |
| Additional Feature Specs | - | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | - | |
| Component Housing Style | Module | |
| Vendor Package Type | Module |
Description
Engineered with Driver features for versatile component usage. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case Module that offers mechanical and thermal protection. Type of package Module that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. The category of RF General Purpose for frequency and modulation specifications. Supplier package type Module for component selection.
MANUFACTURERS: 3 Y POWER TECHNOLOGY | A-BRIGHT INDUSTRIAL CO LTD | AC INTERFACE INC | AMERICAN ACCURATE COMPONENTS | BANNER ENGINEERING | BEHA-AMPROBE | CANTEC ELECTRONIC CO LTD | CANADIAN GENERAL ELECTRIC CO LTD | CONGATEC INC | DABURN ELECTRONICS & CABLE | DYMEC INC | DYNEX SEMICONDUCTOR LTD | EAGLE-PICHER TECHNOLOGIES LLC | EDDING | ELECTRONIC SEALS | ELECTOR ADAPTOR | BOSTON TECHNICAL INC | FIBOX | AEROFLEX/METELICS INC | GEM ASIA ENTERPRISE CO LTD | GENESIC SEMICONDUCTOR INC | 2POWER | AB CONNECTORS LTD