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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| Radio Frequency Protocol | - | |
| Frequency Classification | UHF (1GHz ~ 2GHz) | |
| Band Center Frequency | 1.9GHz | |
| Operational Hz Spectrum | 1.85GHz ~ 1.99GHz | |
| RF Antenna Design | Chip | |
| Frequency Band Quantity | 1 | |
| Voltage Standing Wave Ratio | - | |
| Reflection Loss dB | - | |
| Amplification Factor | - | |
| Maximum Power Handling | - | |
| Key Product Highlights | - | |
| Circuit End Method | Solder | |
| Dust Water Resistance Rating | - | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Upper Height Limit | 0.062" (1.57mm) | |
| Intended Uses | - |
Description
Utilizes a Chip antenna style for improved signal capture. Offers a center frequency of 1.9GHz. Maintains a 1.9GHz center frequency for reliable signal performance. Categorized within the UHF (1GHz ~ 2GHz) frequency range to meet industry standards. Offers a 1.85GHz ~ 1.99GHz frequency spectrum for broad-spectrum applications. Maintains a maximum height of 0.062" (1.57mm) to comply with design standards. Mounting configuration Surface Mount for structural stability. Number of frequency bands 1 for frequency allocation. Type of housing Bulk for safeguarding or transporting components. Product status Obsolete concerning availability and lifecycle. Termination method Solder for electrical or mechanical connections.
