Attribute
Description
Manufacturer Part Number
BGA10M1MN9E6329XTSA1
Manufacturer
Description
RF MMIC 1.8 TO 2.2 GHZ
Manufacturer Lead Time
26 weeks

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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Tape & Reel (TR)
Oscillation Rate Hz 1.8GHz ~ 2.2GHz
1dB Compression Point -20dBm
Amplification Factor 20.6dB
Signal-to-Noise Degradation 12.8dB
Wireless RF Category 4G, 5G
Power Supply Voltage 1.1V ~ 2V
Power Supply Amperage 7.7mA
Benchmark Hz Rate 2.1GHz
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 9-XFLGA
Vendor Package Type PG-TSNP-9-2

Description

Employs supply current defined as 7.7mA. Runs at a frequency of 1.8GHz ~ 2.2GHz. Delivers 20.6dB gain to enhance signal amplification effectiveness. Mounting configuration Surface Mount for structural stability. Noise level 12.8dB affecting amplifier or RF performance. P1dB -20dBm representing the operational capability of the RF amplifier. Type of housing Tape & Reel (TR) for safeguarding or transporting components. Style of the enclosure/case 9-XFLGA that offers mechanical and thermal protection. Type of package PG-TSNP-9-2 that preserves the integrity of the device. The category of RF 4G, 5G for frequency and modulation specifications. Supplier package type PG-TSNP-9-2 for component selection. Voltage requirement 1.1V ~ 2V for electrical specifications. Frequency rate 2.1GHz for assessing performance. Voltage supply 1.1V ~ 2V for device operation.