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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | WE-SECF | |
| IC Encapsulation Type | Tape & Reel (TR)Cut Tape (CT)Digi-Reel® | |
| Availability Status | Active | |
| Device Type Classification | Shield Finger | |
| Physical Shape Form | - | |
| Horizontal Width Dimension | 0.079" (2.00mm) | |
| Linear Length Dimension | 0.118" (3.00mm) | |
| Vertical Dimension | 0.098" (2.50mm) | |
| Construction Material Type | Beryllium Copper | |
| Metal Plating Layer | Gold | |
| Plating Layer Depth | Flash | |
| Mounting Technique | Solder | |
| Ambient Temp Range | -40°C ~ 100°C |
Description
Fastened using a Solder method for dependable placement. Features a height of 0.098" (2.50mm) for accurate dimensional precision. Overall length 0.118" (3.00mm) for size indication. Type of construction material Beryllium Copper for durability and efficiency. Temperature range -40°C ~ 100°C for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. A metallic layer Gold to enhance conductivity and resist corrosion. The thickness of the plating layer Flash according to specifications. Product status Active concerning availability and lifecycle. Classification series for the product or component WE-SECF. Type classification Shield Finger for specifications. Horizontal width measurement 0.079" (2.00mm).
