Attribute
Description
Manufacturer Part Number
S2711-06R
Manufacturer
Description
RFI SHD FINGR CU TIN SLD 1900/RL
Manufacturer Lead Time
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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | EZ BoardWare | |
| IC Encapsulation Type | Tape & Reel (TR) | |
| Availability Status | Obsolete | |
| Device Type Classification | Shield Finger | |
| Physical Shape Form | - | |
| Horizontal Width Dimension | 0.090" (2.28mm) | |
| Linear Length Dimension | 0.346" (8.79mm) | |
| Vertical Dimension | 0.140" (3.55mm) | |
| Construction Material Type | Copper Alloy | |
| Metal Plating Layer | Tin | |
| Plating Layer Depth | 118.11µin (3.00µm) | |
| Mounting Technique | Solder | |
| Ambient Temp Range | -40°C ~ 125°C |
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